CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
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Effects of argon addition to a platinum dry etch process
- K.R. Milkove
- J. Coffin
- et al.
- 1998
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films