Formation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning YaoWei-Tsu Tsenget al.2011ADMETA 2011
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)E. HuangM. Ohet al.2009ADMETA 2009
UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemesY.C. EeD. Kioussiset al.2009ADMETA 2009