Publications

2 results for Toshihiko Nishio

Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2009
- ECTC 2009
Injection molded solder - a new fine pitch substrate bumping method
- - Jae-Woong Nah
  - Peter A. Gruber
  - et al.
- 2009
- ECTC 2009