High yielding self-aligned contact-process for a 0.150-μm DRAM technology
- Thomas S. Rupp
- David Dobuzinsky
- et al.
- 2002
- IEEE Trans Semicond Manuf
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18 results for David Dobuzinsky
A contact-reducing method over topography by combining the RELACS technique and bi-layer process
- Chieh-Yu Lin
- Karen Petrillo
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering
Aluminum dual damascene metallization for 0.175 μm DRAM generations and beyond
- R.F. Schnabel
- L. Clevenger
- et al.
- 2000
- Microelectronic Engineering
CVD of fluorosilicate glass for ULSI applications
- M.J. Shapiro
- S. Nguyen
- et al.
- 1995
- Thin Solid Films
Novel fingered stacked capacitor cell
- Tue Nguyen
- S. Nguyen
- et al.
- 1995
- JES
High Selectivity Magnetically Enhanced Reactive Ion Etching of Boron Nitride Films
- Bernhard Neureither
- Son Nguyen
- et al.
- 1994
- JES
Evidence of a shallow junction formation from plasma enhanced chemical vapor deposition of boron nitride and silicon boron nitride
- Tue Nguyen
- Son Van Nguyen
- et al.
- 1993
- Applied Physics Letters
New leakage mechanism in sub-5-nm oxynitride dielectrics
- Tue Nguyen
- Daniel A. Carl
- et al.
- 1993
- Applied Physics Letters