Blanket SMT with in situ N2 plasma treatment on the lang;100〉 wafer for the low-cost low-power technology application
- Jun Yuan
- Victor Chan
- et al.
- 2009
- IEEE Electron Device Letters
Publications
Date
Featured collections
Popular topics
2 results for Yong Meng Lee
Interaction of middle-of-line (MOL) temperature and mechanical stress on 90nm hi-speed device performance and reliability
- K.Y. Lim
- V. Chan
- et al.
- 2005
- ESSDERC 2005