3-D silicon integration and silicon packaging technology using silicon through-vias
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2006
- IEEE Journal of Solid-State Circuits
Publications
Date
Featured collections
Popular topics
24 results for Raymond Horton
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
A 10.5-in.-diagonal SXGA active-matrix display
- E.G. Colgan
- P.M. Alt
- et al.
- 1998
- IBM J. Res. Dev
A six-mask TFT-LCD process using copper-gate metallurgy
- P.M. Fryer
- E.G. Colgan
- et al.
- 1997
- Journal of the Society for Information Display