Ultra-thin SOI replacement gate CMOS with ALD TaN / high-k gate stackB. DorisB.P. Linderet al.2005VLSI-TSA 2005
Novel techniques for scaling deep trench DRAM capacitor technology to 0.11 μm and beyondP.S. ParkinsonK. Settlemyeret al.2003VLSI-TSA 2003
Time-dependent dielectric breakdown evaluation of deep trench capacitor with sidewall hemispherical, polysilicon grains for gigabit DRAM technologyFen ChenPorshia Parkinsonet al.2002IIRW 2002