A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid BondingSari ZereyJunghyun Choet al.2024ECTC 2024
Role of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D IntegrationSari ZereyRoy Yuet al.2024MRS Spring Meeting 2024