The evolution of barrier properties during reliability testing of Cu interconnects
- M.A. Meyer
- O. Aubel
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
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2 results for D. Gehre
Extensive investigations of temperature influence on barrier integrity during reliability testing
- O. Aubel
- M.A. Meyer
- et al.
- 2008
- Microelectronic Engineering