Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices
- Bing Dang
- Qianwen Chen
- et al.
- 2019
- ECTC 2019
Publications
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8 results for Hongqing Zhang
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
Influence of UBM metallurgy on Sn textures and em failure
- Minhua Lu
- Hongqing Zhang
- 2015
- ECTC 2015
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- G. Wang
- H. Zhang
- et al.
- 2006
- MRS Spring Meeting 2006
Thermal and electromigration-induced strains in polycrystalline films and conductor lines: X-ray microbeam measurements and analysis
- G.S. Cargill III
- L.E. Moyer
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005