Publications

3 results for Andy Fan

Silicon layer stacking enabled by wafer bonding
- - Chuan Seng Tan
  - Kuan-Neng Chen
  - et al.
- 2006
- MRS Fall Meeting 2006
Bonding parameters of blanket copper wafer bonding
- - K.N. Chen
  - A. Fan
  - et al.
- 2006
- Journal of Electronic Materials
The effect of forming gas anneal on the oxygen content in bonded copper layer
- - C.S. Tan
  - K.N. Chen
  - et al.
- 2005
- Journal of Electronic Materials