Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
Publications
3 results for Guy P. Brouillette
Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999