Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
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The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing