The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
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3 results for M.A. Korhonen
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
Stress evolution due to electromigration in confined metal lines
- M.A. Korhonen
- P. Borgesen
- et al.
- 1993
- Journal of Applied Physics