Fifteen Nanometer Resolved Patterns in Selective Area Atomic Layer Deposition - Defectivity Reduction by Monolayer Design
- Rudy J. Wojtecki
- Magi Mettry
- et al.
- 2018
- ACS AMI
Publications
Date
Featured collections
Popular topics
66 results for Hosadurga Shobha
Impact of Liner Metals on Copper Resistivity at beyond 7nm Dimensions
- H. Huang
- Nicholas A. Lanzillo
- et al.
- 2018
- IITC 2018
A Study on SADP Process Refresh for Patterning Correction
- James H.-C. Chen
- Isabel C Estrada-Raygoza
- et al.
- 2018
- IITC 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Future on-chip interconnect metallization and electromigration
- C. K. Hu
- James Kelly
- et al.
- 2018
- IRPS 2018
Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Reactive monolayers in directed additive manufacturing – area selective atomic layer deposition
- Rudy J. Wojtecki
- Anuja DeSilva
- et al.
- 2018
- J. Photopolym. Sci. Tech.
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- Takeshi Nogami
- Raghuveer Patlolla
- et al.
- 2017
- IITC 2017
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017