Fast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010
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53 results for Mark B. Ritter
Electrical and physical parametric study of high-speed link performance
- Ki Jin Han
- Mark B. Ritter
- et al.
- 2010
- EPEPS 2010
Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010
On adding metalization to improve via performance on PCBs
- Albert E. Ruehli
- Xiaoxiong Gu
- et al.
- 2009
- EPEPS 2009
Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
- Xiaoxiong Gu
- Francesco De Paulis
- et al.
- 2009
- DesignCon 2009
A study on crosstalk analysis in aggregative transmission lines with turning vias
- Tapobrata Bandyopadhyay
- Lei Shan
- et al.
- 2009
- ECTC 2009
Bandwidth study of recessed probe launch variations for broadband measurement of embedded PCB structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2009
- GeMIC 2009
Communication technologies for exascale systems
- J.A. Kash
- P. Pepeljugoski
- et al.
- 2009
- SPIE OPTO 2009
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging