Use of SiBN and SiBON films prepared by plasma enhanced chemical vapor deposition from borazine as interconnection dielectrics
- W.F. Kone
- S. Cohen
- et al.
- 1997
- JES
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3 results for B. Luther
Copper interconnection integration and reliability
- C.-K. Hu
- B. Luther
- et al.
- 1995
- Thin Solid Films
Electromigration in two-level interconnects of Cu and Al alloys
- C.-K. Hu
- B. Luther
- 1995
- Materials Chemistry & Physics