A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- Tianji Zhou
- Nicholas A. Lanzillo
- et al.
- 2018
- AIP Advances
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Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering