Three-dimensional a-Si:H solar cells on glass nanocone arrays patterned by self-assembled Sn nanospheres
- Jeehwan Kim
- Augustin J. Hong
- et al.
- 2011
- ACS Nano
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33 results for Jae Woong Nah
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- GFP 2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Circuits 2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Technology 2015
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- IMAPS 2014
Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT