Automated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology
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33 results for Jae Woong Nah
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- Journal of Materials Research
Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
- Jae-Woong Nah
- J.O. Suh
- et al.
- 2006
- Journal of Applied Physics