Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Publications
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78 results for John Knickerbocker
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Electromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2010
- ECTC 2010