Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
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27 results for Kuniaki Sueoka
Nanomaterials for silicon photonic packaging spin-on nanomaterials for optical packaging
- Yoichi Taira
- Kuniaki Sueoka
- et al.
- 2014
- ICEP 2014
Fine-pitch solder joining for high density interconnection
- Kuniaki Sueoka
- Sayuri Kohara
- et al.
- 2014
- ICEP 2014
Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Soichiro Ibaraki
- et al.
- 2013
- 3DIC 2013
Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Scaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Development of vacuum underfill technology for a 3D chip stack
- Katsuyuki Sakuma
- Sayuri Kohara
- et al.
- 2011
- JMM
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010