3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
- J. Safran
- Giri N. K. Rangan
- et al.
- 2016
- ECTC 2016
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9 results for Gary Maier
A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias
- Matt Wordeman
- Joel Silberman
- et al.
- 2012
- ISSCC 2012
A 3.0 TFLOPS 0.62V Scalable Processor Core for High Compute Utilization AI Training and Inference
- Jinwook Oh
- Sae Kyu Lee
- et al.
- 2020
- VLSI Circuits 2020
A Scalable Multi-TeraOPS Deep Learning Processor Core for AI Trainina and Inference
- Bruce Fleischer
- Sunil Shukla
- et al.
- 2018
- VLSI Circuits 2018
Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
A shorted global clock design for multi-GHz 3D stacked chips
- Liang-Teck Pang
- Phillip J. Restle
- et al.
- 2012
- VLSI Circuits 2012
Efficient AI System Design with Cross-Layer Approximate Computing
- Swagath Venkataramani
- Xiao Sun
- et al.
- 2020
- Proceedings of the IEEE
A Scalable Multi-TeraOPS Core for AI Training and Inference
- Sunil Shukla
- Bruce Fleischer
- et al.
- 2018
- IEEE SSC-L
Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias
- Toshiaki Kirihata
- John Golz
- et al.
- 2016
- IEEE JESTCS