Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- P. Bhosale
- J. Maniscalco
- et al.
- 2018
- IITC 2018
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60 results for Nick Lanzillo
Validity and Application of the TCR Method to MOL contactS
- E. Milosevic
- Vimal Kamineni
- et al.
- 2018
- IITC 2018
Impact of Liner Metals on Copper Resistivity at beyond 7nm Dimensions
- H. Huang
- Nicholas A. Lanzillo
- et al.
- 2018
- IITC 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Next-Generation Logic Design Architecture for Vertical-Transport Nanosheets
- Biswanath (Biswa) Senapati
- Jeongho Do
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Unconventional resistivity scaling in topological semimetal CoSi
- Shang-Wei Lien
- Ion Garate
- et al.
- 2023
- npj Quantum Materials
Chip Power-Frequency Scaling in 10/7nm Node
- Phil Oldiges
- Reinaldo A. Vega
- et al.
- 2020
- IEEE Access
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- R. S. Smith
- E. T. Ryan
- et al.
- 2019
- AIP Advances
A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- Tianji Zhou
- Nicholas A. Lanzillo
- et al.
- 2018
- AIP Advances