An acid-based electroless Cu deposition process: Chemical formulation, film characteristics and CMP performance
- Wei-Tsu Tseng
- Chia-Hsien Lo
- et al.
- 2000
- ECS Meeting 2000
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29 results for Wei-Tsu Tseng
Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing
- Victor Chan
- A. Gasasira
- et al.
- 2023
- IEEE Trans Semicond Manuf
Understanding the Reasons behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes
- Y. Sampurno
- A. Philipossian
- et al.
- 2021
- ECS J. Solid State Sci. Technol.
CMP Challenges for Advanced Technology Nodes
- John H Zhang
- Haigou Huang
- et al.
- 2017
- MRS Advances
Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- Wei-Tsu Tseng
- Sana Rafie
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
BEOL Cu CMP process evaluation for advanced technology nodes
- Kunaljeet Tanwar
- Donald Canaperi
- et al.
- 2013
- JES
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters