Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- IEDM 2017
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5 results for Wolfram Steller
Microfluidic Interposer for High Performance Fluidic Chip Cooling
- Wolfram Steller
- Frank Windrich
- et al.
- 2018
- ESTC 2018
Dual-Side Heat Removal by Silicon Cold Plate and Interposer with Embedded Fluid Channels
- Thomas Brunschwiler
- Wolfram Steller
- et al.
- 2018
- ITherm 2018
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Stress investigations in 3D-integrated silicon microstructures
- M. Stiebing
- Emanuel Lörtscher
- et al.
- 2016
- EuroSimE 2016