Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016
Publications
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37 results for Gerd Schlottig
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016
Master curve synthesis by effective viscoelastic plastic material modeling
- Florian Schindler-Saefkow
- Remi Pantou
- et al.
- 2016
- EuroSimE 2016
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- Brian R. Burg
- Jonas Zürcher
- et al.
- 2015
- EMPC 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
Thermal characterization of percolating thermal underfills: Bulk and cavity
- Brian R. Burg
- Manuel Koilly
- et al.
- 2014
- THERMINIC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014