Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
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37 results for Gerd Schlottig
Wafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
Study of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014
Thermo-mechanical properties of underfills at partial and full filler percolation - Sub-layering the underfill
- Gerd Schlottig
- Marie Haupt
- et al.
- 2014
- EuroSimE 2014
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
Enhanced electrical and thermal interconnects by the selfassembly of nanoparticle necks utilizing capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2013
- InterPACK 2013
Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
- Gerd Schlottig
- Florian Schindler-Saefkow
- et al.
- 2013
- EPTC 2013
Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
- Ningkang Li
- Gerd Schlottig
- et al.
- 2013
- THERMINIC 2013
Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Directed self-assembly of nanoparticles for novel electrical interconnects
- Yu Liu
- Gerd Schlottig
- et al.
- 2012
- ESTC 2012