A multivariate parameter analysis of copper pillars eases the design of denser interconnects
- Gerd Schlottig
- Thomas Brunschwiler
- et al.
- 2012
- EuroSimE 2012
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37 results for Gerd Schlottig
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
Lid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
- Chander Shekhar Sharma
- Gerd Schlottig
- et al.
- 2015
- Int. J. Heat Mass Transf.
Energy efficient hotspot-targeted embedded liquid cooling of electronics
- Chander Shekhar Sharma
- Manish K. Tiwari
- et al.
- 2015
- Applied Energy