Microfluidic Interposer for High Performance Fluidic Chip Cooling
- Wolfram Steller
- Frank Windrich
- et al.
- 2018
- ESTC 2018
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3 results for M. Jurgen Wolf
Stress investigations in 3D-integrated silicon microstructures
- M. Stiebing
- Emanuel Lörtscher
- et al.
- 2016
- EuroSimE 2016
3D Si-level integration in wireless sensor node
- Piet Van Engen
- Ric Van Doremalen
- et al.
- 2009
- SSI 2009