Publications

68 results for Terry A. Spooner

Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- - Rod Augur
  - Craig Child
  - et al.
- 2010
- ADMETA 2010
Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- - F. Ito
  - H. Shobha
  - et al.
- 2010
- ADMETA 2010
Patternable low-κ material for "greener" semiconductor manufacturing
- - Qinghuang Lin
  - Shyng-Tsong Chen
  - et al.
- 2010
- ICSICT 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Multi-level integration of patternable low-κ material into advanced Cu BEOL
- - Qinghuang Lin
  - Shyng-Tsong Chen
  - et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- - Qinghuang Lin
  - Alshakim Nelson
  - et al.
- 2010
- Japanese Journal of Applied Physics
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- - Takeshi Nogami
  - Chih-Chao Yang
  - et al.
- 2008
- ADMETA 2008
Interconnect performance and scaling strategy for the 22 nm node and beyond
- - James H.-C. Chen
  - Lijun Jiang
  - et al.
- 2008
- ADMETA 2008
Integration compatible porous SiCOH dielectrics from 45 to 22 nm
- - S. Gates
  - A. Grill
  - et al.
- 2008
- ADMETA 2008
Material and process for advanced Cu/ULK integration
- - Chih-Chao Yang
  - Daniel C. Edelstein
  - et al.
- 2008
- ADMETA 2008