Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- IEDM 2017
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3 results for Jessica Kleff
Dual-Side Heat Removal by Silicon Cold Plate and Interposer with Embedded Fluid Channels
- Thomas Brunschwiler
- Wolfram Steller
- et al.
- 2018
- ITherm 2018
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016