Electrical and physical parametric study of high-speed link performance
- Ki Jin Han
- Mark B. Ritter
- et al.
- 2010
- EPEPS 2010
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93 results for Xiaoxiong Gu
Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
- Xiaoxiong Gu
- Francesco De Paulis
- et al.
- 2009
- DesignCon 2009
On adding metalization to improve via performance on PCBs
- Albert E. Ruehli
- Xiaoxiong Gu
- et al.
- 2009
- EPEPS 2009
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2009
- EPEPS 2009
Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs
- Arun Reddy Chada
- Young H. Kwark
- et al.
- 2009
- EPEPS 2009
Bandwidth study of recessed probe launch variations for broadband measurement of embedded PCB structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2009
- GeMIC 2009
Impedance design for multi-layered vias
- Xiaoxiong Gu
- Albert E. Ruehli
- et al.
- 2008
- EPEPS 2008
Application of foldy-lax multiple scattering method to via analysis in multi-layered printed circuit board
- Xiaoxiong Gu
- Mark B. Ritter
- 2008
- DesignCon 2008
Multi-level signaling in high-density, high-speed electrical links
- Dong G. Kam
- Troy J. Beukema
- et al.
- 2008
- DesignCon 2008
Eliminating via-plane coupling using ground vias for high-speed signal transitions
- Songping Wu
- Xin Chang
- et al.
- 2008
- EPEPS 2008