An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
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93 results for Xiaoxiong Gu
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2014
- IEEE Transactions on CPMT
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- Xiaoxiong Gu
- Joel A. Silberman
- et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2012
- IEEE Trans. Instrum. Meas.
Design and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
- Boping Wu
- Xiaoxiong Gu
- et al.
- 2011
- Microwave and Optical Technology Letters
Random rough surface effects on wave propagation in interconnects
- Leung Tsang
- Henning Braunisch
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat