The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
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148 results for Thomas M. Shaw
Towards an appropriate acceleration model for beol tddb
- Ramachandran Muralidhar
- Eric G. Liniger
- et al.
- 2016
- IRPS 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015
Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
- A. Raja
- Robert B. Laibowitz
- et al.
- 2015
- Microelectronic Engineering
First realization of the piezoelectronic stress-based transduction device
- Josephine B. Chang
- Hiroyuki Miyazoe
- et al.
- 2015
- Nanotechnology
The piezoelectronic stress transduction switch for very large-scale integration, low voltage sensor computation, and radio frequency applications
- I.-B. Magdû
- Xiao Hu Liu
- et al.
- 2015
- Applied Physics Letters
Pathway to the Piezoelectronic Transduction Logic Device
- Paul Solomon
- Brian A. Bryce
- et al.
- 2015
- Nano Letters
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
Spatial mapping of non-uniform time-to-breakdown and physical evidence of defect clustering
- Ernest Y. Wu
- Baozhen Li
- et al.
- 2014
- VLSI Technology 2014