Stress relaxation in Cu thin films
- C. Witt
- R. Rosenberg
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
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148 results for Thomas M. Shaw
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials
Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
- A. Raja
- Robert B. Laibowitz
- et al.
- 2015
- Microelectronic Engineering
First realization of the piezoelectronic stress-based transduction device
- Josephine B. Chang
- Hiroyuki Miyazoe
- et al.
- 2015
- Nanotechnology
The piezoelectronic stress transduction switch for very large-scale integration, low voltage sensor computation, and radio frequency applications
- I.-B. Magdû
- Xiao Hu Liu
- et al.
- 2015
- Applied Physics Letters
Pathway to the Piezoelectronic Transduction Logic Device
- Paul Solomon
- Brian A. Bryce
- et al.
- 2015
- Nano Letters
Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects
- Juan Borja
- Joel L. Plawsky
- et al.
- 2014
- JVSTA