Overlay as the key to drive wafer scale 3D integration
- Steven E. Steen
- Douglas LaTulipe
- et al.
- 2007
- Microelectronic Engineering
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35 results for Steven Steen
Three-dimensional integrated circuits
- Anna W. Topol
- Douglas C. La Tulipe Jr.
- et al.
- 2006
- IBM J. Res. Dev
Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes
- Steven Steen
- Sharee J. McNab
- et al.
- 2006
- Microelectronic Engineering
80 nm gate-length Si/Si0.7Ge0.3 n-MODFET with 194 GHz fmax
- S.J. Koester
- K.L. Saenger
- et al.
- 2003
- Electronics Letters
PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis
- M. McManus
- J.A. Kash
- et al.
- 2000
- Microelectronics Reliability