Internet of the Body and Cognitive Hypervisor
- R. Strassle
- S. Gerke
- et al.
- 2017
- CHASE 2017
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3 results for R. Strassle
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016