Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
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Thermal analysis of multi-layer functional 3D logic stacks
- Michael Scheuermann
- Shurong Tian
- et al.
- 2016
- 3DIC 2016