Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
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4 results for Hongbing Lu
Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- Tingge Xu
- Yingjie Du
- et al.
- 2017
- IITC 2017
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials