Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
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21 results for C. Witt
Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
- Mikhail Treger
- Christian Witt
- et al.
- 2013
- Journal of Applied Physics
Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Robert Rosenberg
- et al.
- 2013
- Journal of Applied Physics
Understanding stress gradients in microelectronic metallization
- Conal E. Murray
- E. Todd Ryan
- et al.
- 2012
- Powder Diffraction
Evolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
Stress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters
Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Journal of Materials Research
A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
- Andrew Ying
- Christian Witt
- et al.
- 2011
- Journal of Applied Physics
In situ evolution of stress gradients in Cu films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2010
- Applied Physics Letters
Stress gradients induced in Cu films by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2008
- Applied Physics Letters