Design intent optimization at the beyond 7nm node: The intersection of DTCO and EUVL stochastic mitigation techniquesMichael CrouseL. Liebmannet al.2017SPIE Advanced Lithography 2017
Printability and actinic AIMS review of programmed mask blank defectsErik VerduijnPawitter Mangatet al.2017SPIE Advanced Lithography 2017