High performance thick copper inductors in an RF technology
- Kunal Vaed
- William Graham
- et al.
- 2004
- SPIE Micromachining and Microfabrication 2004
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22 results for William S. Graham
Electroless deposition of Cu on glass and patterning with microcontact printing
- Emmanuel Delamarche
- James Vichiconti
- et al.
- 2003
- Langmuir
Electroless deposition of NiB on 15 inch glass substrates for the fabrication of transistor gates for liquid crystal displays
- Emmanuel Delamarche
- Matthias Geissler
- et al.
- 2003
- Langmuir
Dry vertical alignment method for multi-domain homeotropic thin-film-transistor liquid crystal displays
- C. Cai
- Alan Lien
- et al.
- 2001
- Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998
A 10.5-in.-diagonal SXGA active-matrix display
- E.G. Colgan
- P.M. Alt
- et al.
- 1998
- IBM J. Res. Dev
A six-mask TFT-LCD process using copper-gate metallurgy
- P.M. Fryer
- E.G. Colgan
- et al.
- 1997
- Journal of the Society for Information Display
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990