Critical Elements for Next Generation High Performance Computing Nanosheet TechnologyR. BaoC. Durfeeet al.2021IEDM 2021
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnectsKoichi MotoyamaNicholas A. Lanzilloet al.2022IITC 2022
Predicting overlay mark performance based on process emulation and optical simulationSagarika MukeshJack Wonget al.2022SPIE Advanced Lithography 2022
Simulation of photoresist defect transfer through subsequent patterning processesDominik MetzlerMohamed Oulmaneet al.2020SPIE Advanced Lithography 2020
A Review of the Gate-All-Around Nanosheet FET Process OpportunitiesSagarika MukeshJingyun Zhang2022Electronics (Switzerland)
A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology NodesSagarika MukeshNicholas A. Lanzillo2023IEEE T-ED