Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
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3 results for Katie Lutker-Lee
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- Yannick Feurprier
- Katie Lutker-Lee
- et al.
- 2015
- SPIE Advanced Lithography 2015
Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement
- Katie Lutker-Lee
- Jennifer Church
- et al.
- 2022
- Journal of Vacuum Science and Technology B