All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
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2 results for Maaike M. Visser Taklo
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015