Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2011
- SEMI-THERM 2011
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15 results for Bernhard Wunderle
Heat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Forced convective interlayer cooling in vertically integrated packages
- 2008
- ITherm 2008
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Interlayer cooling potential in vertically integrated packages
- 2008
- Microsystem Technologies