3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
- J. Safran
- Giri N. K. Rangan
- et al.
- 2016
- ECTC 2016
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3 results for Joyeeta Nag
ALD TaN barrier for enhanced performance with low contact resistance for 14 nm Technology Node Cu Interconnects
- Joyeeta Nag
- Brian A. Cohen
- et al.
- 2015
- ECS Meeting 2015 Phoenix
Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line Copper Dual-Damascene Structures
- Joyeeta Nag
- S. Ray
- et al.
- 2015
- IEEE Trans Semicond Manuf