Microstructure, impurity and metal cap effects on Cu electromigration
- C. K. Hu
- Lynne Gignac
- et al.
- 2012
- AIP-CP 2012
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61 results for Robert Rosenberg
Effects of metal capping on thermal annealing of copper interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- C.-K. Hu
- J. Ohm
- et al.
- 2012
- Journal of Applied Physics
Low-temperature reflow anneals of Cu on Ru
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2011
- IEEE Electron Device Letters
Stress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters
A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
- Andrew Ying
- Christian Witt
- et al.
- 2011
- Journal of Applied Physics
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Stress relaxation in Cu thin films
- C. Witt
- R. Rosenberg
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
On the direction of electromigration in gold thin films
- I.A. Blech
- R. Rosenberg
- 2008
- Journal of Applied Physics
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films