Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
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5 results for C.R. Kao
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Effects of Ti addition to Sn-Ag and Sn-Cu solders
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- Journal of Alloys and Compounds
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- Albert T. Wu
- N. Tamura
- et al.
- 2005
- MRS Spring Meeting 2005
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
- Albert T. Wu
- K.N. Tu
- et al.
- 2004
- Applied Physics Letters